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Postdoc researcher position of MD and FEM simula ... (No replies)
- Project name: ‘Development of materials and process technology for flip chip package with 20 um micro-bump’
- Project information: Our project addresses the effect of mechanical stress at manufacturing process and reliability of semiconductor chips using experiments and computational analysis. The candidate will do MD simulations of void growth and FEM simulations to identify mechanical stress distribution at Cu interconnect.
- Institution: Korea Institute of Industrial Technology (KITECH), http://eng.kitech.re.kr/main/
- Address: Ulsan, South Korea
- Salary: $3000/month ~ $3500/month (according to qualifications and experience)
- Contract period: yearly contract, max 3 years
- Required skills: Atomistic simulation (DFT, MD) : indispensible, FEM : optional
- Contact information: Dr. Dong-Hyun Kim, [email protected] or [email protected]
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