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Webinar: IBM Research and Synopsys QuantumATK on ... (No replies)
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Scaling of semiconductor logic technologies to the 3nm node and beyond motivates the evaluation of new metals for the power rails and signal wires to mitigate the rising impact of interconnect parasitics on performance. The current solution based on copper and a barrier metal exhibits a significant rise in resistivity as conductor widths decrease, which leads to lower performance and higher IR drop.
Join us for this webinar to learn about Synopsys work with IBM Research and recently developed atomic-scale QuantumATK to TCAD Raphael FX workflow on supporting the exploration and eventual integration of alternative metals.
Date: 24th of June, 2020
Time 1: 9 AM CEST (Europe) / 12.30 pm IST (India) / 3 pm CST (China) / 4 pm KST (South Korea) / 4 pm JST (Japan)
Time 2: 12 pm EDT (US East Coast) / 9 am PDT (US West Coast)/ 6 pm CEST (Europe)
Duration: 1 hour (including Q&A session)
NOTE: please click on the drop-down menu to choose the most convenient time for you.
Register for the webinar here.
Presented by:
• Timothy Philip, PhD, Research Staff Member for IBM Research
• Troels Markussen, PhD, Senior R&D Engineer for Synopsys QuantumATK
• Shela Aboud, PhD, R&D Engineer for Synopsys TCAD
In this webinar you will learn:
• How to simulate vertical resistance in vias, i.e., interfaces between various conductor, adhesion liners, wetting and diffusion layers.
• How to efficiently evaluate resistance due to scattering at grain boundaries (GBs) in metals using Sentaurus Materials Workbench (SMW) under QuantumATK. SMW automates key tasks such as easily building and relaxing a large set of GBs, calculating GB reflection coefficients and GB resistivity for different average grain sizes.
• How the results from SMW can be automatically incorporated into the TCAD Raphael FX simulations to extract interconnect resistance and capacitance of complex process structures.
This webinar is targeted to atomic-scale, technology development and TCAD teams working with advanced logic processes.
You are welcome to ask questions throughout the webinar or at the end during the Q&A session.
For any questions about the webinar, please contact [email protected]
Register for the webinar here.