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CECAM/Psi-k Workshop: "Chemical and Structural T ... (No replies)
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Dear Colleague,
there are still a few places available for the 4-day CECAM/Psi-k Workshop on
"Chemical and structural transformations in materials under mechanical load",
that will take place at the EPFL campus in Lausanne from Tuesday 1st September to Friday 4th September 2015.
The focus of the workshop will be on materials’ structural and chemical transformations that are caused by external loads and in turn determine the materials macroscopic mechanical response. Particular attention will be devoted to the following thematic areas:
This workshop will bring together world leading experimentalists and modellers to highlight the most relevant open problems and identify those which can be attacked by combining existing techniques. We are encouraging participation by EU industry representatives who carry out experimental R&D but are not necessarily familiar with the existing state of art modelling tools.
More background information about the workshop can be found athttp://www.cecam.org/workshop-1148.html, where the workshop programme will also be published in due course.
A list of confirmed speakers and participants can be found at http://www.cecam.org/workshop-1-1148.html.
We encourage young researchers to apply and submit an abstract for a poster presentation. Detailed information about the workshop, as well as the application form, can be found at http://www.cecam.org/workshop-0-1148.html. When applying, please provide a very brief outline CV and give some motivation for your interest in attending the workshop.
Since the number of participants is limited due to space reasons, we suggest to apply as soon as possible. Note that no registration fees will be applied. U.S.-based participants can apply for travel funding through thetravel award (http://mcc.illinois.edu/travel/) program of the Materials Computation Center of the University of Illinois at Urbana-Champaign.
Looking forward to welcoming you in Lausanne,
Alessandro De Vita (King’s College London)
James Kermode (University of Warwick)
Gianpietro Moras (Fraunhofer IWM, Freiburg)
Lars Pastewka (Karlsruhe Institute of Technology)
Mike Payne (University of Cambridge)