Submit your abstracts to the APS March Meeting: March 15-19, 2021! (To be held virtually)

ABSTRACT SUBMISSION DEADLINE: October 23, 2020

We are looking forward to your contribution to the session 16.01.15

Heat transport in condensed systems: ballistic, hydrodynamic, diffusive, and quantum (DCOMP)
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Thermal transport plays a key role in many phenomena in condensed and low-dimensional systems and has vital implications in thermoelectric applications. Heat management is also a key technological challenge in electronic, photonic, and solar cell devices. Recent advances in materials science and device fabrication offer new opportunities for an interplay of electronic and phononic degrees of freedom, leading to complex device cooling pathways. Low-dimensional materials exhibit unique hydrodynamics often distinct from that observed in typical three-dimensional materials. Additionally, while vibrations can be considered thermal noise, single phonons could be used to carry quantum information, offering new paradigms in quantum information science and technology. Corresponding recent developments in modeling and simulation provide new opportunities to gain fundamental insights to these emerging behaviors.

This session will focus on thermal transport in the diffusive, hydrodynamic, and ballistic regimes, on interfacial thermal resistance, on quantum phononics, and on first- principles and molecular dynamics simulations of thermal conductivity and phonon drag in nanostructures, 2D materials, and bulk materials.

Best regards

The organizing committee

Vasili Perebeinos (University at Buffalo, SUNY)
Elif Ertekin  (University of Illinois at Urbana-Champaign)
Nicola Marzari  (EPFL- École polytechnique fédérale de Lausanne )

Abstracts can be submitted at:
https://www.aps.org/meetings/march/abstracts/index.cfm

Please review the abstract submission instructions:
https://march.aps.org/abstracts/

Info about the March Meeting:
https://march.aps.org/